Analysis of the Infuence of Different Plastic Packaging Materials on Product Delamination of IC Components

Liu Dongmei(Department of Quality Control, Beijing Smart-Chip Microelectronics Technology Co., Ltd.)
Wang Wenhe(Department of Quality Control, Beijing Smart-Chip Microelectronics Technology Co., Ltd.)
Pang Zhenjiang(Department of Quality Control, Beijing Smart-Chip Microelectronics Technology Co., Ltd.)
Ji Lianhe(Department of Quality Control, Beijing Smart-Chip Microelectronics Technology Co., Ltd.)
Wang Jian(Department of Quality Control, Beijing Smart-Chip Microelectronics Technology Co., Ltd.)
Yu Zhengqiang(Department of Quality Control, Beijing Smart-Chip Microelectronics Technology Co., Ltd.)
Zheng Pingping(Department of Quality Control, Beijing Smart-Chip Microelectronics Technology Co., Ltd.)

Abstract

Due to the high hygroscopicity of the plastic packaging material, the device is inevitably subjected to high temperature or high humidity environment during the production and testing process. After the moisture is expanded, the internal stress is too large, and the delamination and gold wire breakage are formed. At the same time, due to the difference in the coefficient of thermal expansion (CTE) between the plastic packaging material and the materials such as Si and Cu, it is easy to form delamination under a relatively large shear force. The water vapor remaining in the plastic packaging material is the root cause of delamination, and the reflow process and temperature are the predisposing factors leading to delamination. However, it has been found through experiments that different plastic packaging materials have different hygroscopicity and cohesiveness, and they have obvious improvement effects on delamination.

Keywords

Plastic package;Hygroscopicity;Cohesiveness;Stress;Delamination;Improvement

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DOI: http://dx.doi.org/10.26549/met.v3i1.1527